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Two-Dimensional Simulation of Scanning Capacitance Microscopy Measurements of Arbitrary Doping Profiles

机译:任意掺杂型材扫描电容显微镜测量的二维模拟

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Accurate prediction of doping distributions in modern VLSI devices (e.g. shallow junctions) with TCAD tools represents a major challenge which requires the process simulation models to be accurately tuned on the basis of two-dimensional dopant profile measurements. Scanning capacitance microscopy is a scanning probe based technique which provides images with spatial resolution in the 10 nm range. The extraction of quantitative doping information from the raw experimental data requires a calibration procedure. Presently, most of the results are obtained either with a large reverse simulation effort or with a first-order data inversion procedure (direct inversion). The current assumption of the latter approach is the quasi-uniformity of the doping profile. The scope of the present paper is to investigate the limits of this simplified approach by two-dimensional simulations of SCM measurements.
机译:具有TCAD工具的现代VLSI设备中掺杂分布的精确预测TCAD工具代表了需要基于二维掺杂剂轮廓测量来精确调整过程模拟模型的主要挑战。扫描电容显微镜是一种基于扫描探头的技术,其在10nm范围内提供空间分辨率的图像。从原始实验数据中的定量掺杂信息的提取需要校准程序。目前,大多数结果都以大的反向模拟工作或具有一阶数据反转过程(直接反转)获得。后一种方法的当前假设是掺杂型材的准均匀性。本文的范围是通过SCM测量的二维模拟来研究这种简化方法的限制。

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