Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs

摘要

An integration packaging technology, Embedded Power, has been developed for fabricating IPEMs and PEBBs. The bare power chips are buried in the ceramic frame and encapsulated with screen-printed dielectric. High-density interconnect metallization, between power devices and surface mountable electronics circuitry, was fabricated using sputtering and electroplating technologies. Prototype modules have demonstrated the feasibility of this packaging approach.