首页> 外国专利> INTEGRATION OF EBG STRUCTURES (SINGLE LAYER/MULTI-LAYER) FOR ISOLATION ENHANCEMENT IN MULTILAYER EMBEDDED PACKAGING TECHNOLOGY AT MMWAVE

INTEGRATION OF EBG STRUCTURES (SINGLE LAYER/MULTI-LAYER) FOR ISOLATION ENHANCEMENT IN MULTILAYER EMBEDDED PACKAGING TECHNOLOGY AT MMWAVE

机译:在MWWAVE上集成EBG结构(单层/多层)以增强多层嵌入式包装技术中的隔离度

摘要

A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
机译:一种封装的雷达,包括层压板层,与所述层压板层中的至少一个层压板相关联的接地平面,与所述层压板层中的至少一个层压板相关联的发射天线和接收天线,以及在所述发射天线和所述接收板之间的电磁带隙结构。用于隔离发射天线和接收天线的天线,电磁带隙结构包括形成相邻列的基本单元,每个相邻单元耦合到接地平面,每个基本单元包括导电平面元件和耦合到导电平面元件的柱状元件。

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