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Lattice Defects in Si_(1-x)Ge_x Devices by Proton Irradiation and their Effect on Device Performance

机译:通过质子辐照晶格(1-X)GE_X器件缺陷及其对器件性能的影响

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Results are presented of an extended study on the induced lattice defects and their effects on the electrical performance of n~+-Si/p~+-Si_(1-x)Ge_x/n-Si epitaxial diodes and heterojunction bipolar transistors (HBTs), subjected to a 20 and 86-MeV proton irradiation. The degradation of the electrical device performance increases with increasing proton fluence, while it decreases with increasing germanium content and proton energy. The induced lattice defects in the Si_(1-x)Ge_x epitaxial layers and the Si substrate are studied by DLTS. In the SI_(1-x)Ge_x diode epitaxial layers, electron capture levels associated with interstitial - substitutional boron complex are induced by irradiation, while two electron capture levels corresponding to the E-center and the divacancy are observed in teh collector region of the HBTs. The influence of the radiation source on device degradation is discussed taking into account the number of knock-on atoms and the nonionizing energy loss (NIEL). The radiation source dependence of performance degradation is attributed to the difference of mass and the probability of nuclear collision for the formation of lattice defects.
机译:结果提出了对诱导的晶格缺陷的延长研究及其对N〜+ -SI / P〜+ -SI_(1-X)GE_X / N-SI外延二极管和异质结双极晶体管(HBT)的电气性能的影响,经过20和86meV质子辐射。随着锗含量和质子能量的增加,电气设备性能的降低增加了。通过DLT研究了Si_(1-x)Ge_x外延层和Si衬底中的诱导的晶格缺陷。在Si_(1-x)Ge_x二极管外延层中,通过辐射诱导与间隙 - 替换硼络合物相关的电子捕获水平,而在TEH集电极区中观察到与电子中心对应的两个电子捕获水平。 HBT。考虑到敲击原子的数量和非离子能量损失(Niel),讨论了辐射源对器件劣化的影响。性能下降的辐射源依赖性归因于质量差异和核碰撞的概率来形成晶格缺陷。

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