Photosensitive Dielectric Film for build-Up Circuit Boards

摘要

We have developed a new photosensitive dielectric material, PAID (Photosensitive Acryl-Imide Dielectric), for build-up circuit boards. The varnish of PAID consists of a non-photosensitive polyimide precursor, acrylic monomers, a photoinitiator, and additives. PAID film can be cured at 200 deg C, therefore an organic substrate can be used as a substrate for build-up circuit boards. This paper describes some technical advantages of PAID, which is cured at 200 deg C, in comparison with general photosensitive epoxy and general photosensitive polyimide.