BUILD-UP FILM STRUCTURE, CIRCUIT BOARD MANUFACTURED USING BUILD-UP FILM STRUCTURE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING BUILD-UP FILM STRUCTURE

摘要

The present invention relates to a build-up film structure. The build-up film structure according to one embodiment of the present invention includes a core layer having a resin and an inorganic filler, a first bonding layer which covers one surface of the core layer and has less inorganic filler than the core layer, and a second bonding layer which covers the other surface of the core layer and has less inorganic filler than the core layer.;COPYRIGHT KIPO 2014