Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

机译：曝光垫包装模具附着引起的两个电气故障分析

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Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

机译：模具连接在模具粘合过程中是众所周知的。它的电气角色很简单。但是由模具附着引起的一些故障并不是那么简单。通过通用分析流程来分析是不合适的。本文提出了由模具附着引起的两个故障的分析。

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《International Symposium for Testing and Failure Analysis》|2014年||共5页
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Jinglong Li; Motohiko Masuda; Yi Che; Miao Wu;
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中图分类 TG8-53;
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Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

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