A new Type of electrodeposited copper foil for a flexible printed wiring board. Rolled foil has been used to data for a flexible printed wiring board although rolled foil is more expenxive than electrodeposited foil. Rolled foil can recrystallize during a heat process of the flexible printed wiring board which improves the ductility. However, an electrodeposited foil dosen't recrystallize at a low temperature and has low ductility. These are some reasons why rolled foil has been used for many kinds of flexible printed wiring boards in comparison to electrodeposited foil. CIRCUIT FOIL JAPAN CO.,LTD. has developed a new electrodeposited copper foil for a flexible printed wiring board. This foil can recrystallize at about 120RD, and has high ductility. Moreover, the new electrodeposited foil has a higher etch factor than a conventional electrodeposited foil. This new foil will be used for many kinds of flexible printed wiring boards in the future, replacing rolled foil.
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