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Electron microscopy techniques for evaluating epitaxial and bulk III-V compound semiconductors

机译:用于评估外延和散装III-V复合半导体的电子显微镜技术

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Electron microscopy is an important technique to study interfaces and microdefects in advanced III-V compound semiconductors. The paper briefly reviews some of the TEM methods used to this purpose and shows examples of their application to the characterization of epitaxial structures such as InGaAs/GaAs and GaAs/Ge as well as processed substrates like implanted InP.
机译:电子显微镜是一种研究高级III-V复合半导体中的界面和微碎片的重要技术。本文简要介绍了一些用于此目的的一些TEM方法,并展示其应用于外延结构的应用,例如InGaAs / GaAs和GaAs / Ge以及植入式InP的加工基板。

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