Modern bonding processes for large-scale integrated circuits, memory modules and multichip modules in plastic packages

摘要

It is noted that the decisive factor for the very high market share held by plastic packages is the much lower material and processing costs of designs based on the leadframe compared with the category of singulated devices. For the lower processing costs there are several reasons: handling of lead-frame can be easily automated, rapid gold ball/wedge wire bonding, and automatic encapsulation of the components. The possibilities and the currently valid process limits of this technology are demonstrated. For the plastic packaging of LSI memory modules, novel assembly processes have been developed by IBM and Hitachi. The concept of a multichip module in a plastic package, based on them, is presented.