Cost effective Optoeelectronic packaging for multichip modules and backplane level optical interconnect

摘要

[[abstract]]Optical backplanes are of increasing interest for commercial and military avionic processors, and for commercial supercomputers. Projected interconnection density limits of electrical interconnects are rapidly becoming a bottleneck, preventing optimal exploitation of electronic processor capability. A potential obstacle to the commercial development of optoelectronic interconnect components for backplane-based systems is the small market for such specialized technology. In order to ensure that a cost effective solution is available for backplane based systems, commonality with a higher volume application is required. We describe optical packaging techniques for board level waveguides and multichip modules which exploit materials, processes and equipment already in widespread use in the electronics industry, and which can also be applied to a wide range of optoelectronic modules for local area network and telecommunications applications. Rugged polyetherimide waveguides with losses of 0.24 dB/cm have been integrated with conventional circuit board materials, and optoelectronic die have been packaged in a multichip module process using equipment normally used for purely electronic packaging. Practical optical interfaces and connectors have been demonstrated for board-to-backplane and board-to-multichip module applications, and offer increased pincount over their electrical counterparts while retaining compatibility with existing electrical connector alignment and fabrication tolerances.