Using the Atomic Force Microscope to measure submicron dimensions of integrated circuit devices and processes

摘要

Decreasing dimensions in the processing and manufacture of integrated circuits (ICs) has stimulated interest in ultra-high resolution measuring technologies. The Atomic Force Microscope (AFM), which is now available commercially, offers three-dimensional surface measurement capability from angstroms to over 100 microns, the ability to image insulators directly without coating, and minimal sample preparation. These features indicate strong potential for applications in IC related inspection, process engineering, failure analysis and reliability, particularly as ICs move toward submicron geometries.