Ultrasonic complex vibration welding systems of 100kHz to 200kHz with large welding tip area for packaging in microelectronics

摘要

Ultrasonic complex vibration welding systems of 100 to 200 kHz using a complex vibration welding tip with large area vibrating in elliptical to circular locus were studied. The complex vibration Systems have a welding tip part of 21 mm × 21 mm area which is available for direct welding of semiconductor tips of 20 mm square on substrate (face down bonding) and packaging of various electronic devices.