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Impact of Multi-Metal Gate Stacks on the Performance of β-Ga_2O_3 MOS Structure

机译:多金属栅极堆栈对β-GA_2O_3 MOS结构性能的影响

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Gallium oxide (Ga_2O_3) due to its Ultra-wide bandgap (UWB) becomes the most promising semiconductor material for future-generation electronic applications. The Ga_2O_3 semiconductor possesses excellent material properties such as ultra-wide bandgap of 4.8 eV, ability to withstand breakdown field ranging from 5 to 9 MV/cm along with superior thermal and chemical stability. Also, it has excellent Baliga's figure-of-merit (B-FOM). However, the performance of β-Ga_2O_3 devices is still limited due to the issue related to good ohmic contact materials. In this work, we have studied the Impact of using multi-metal gate stack arrangements on the performance of β-Ga_2O_3 MOS Structure. The performance parameters used in the analysis are I_(Dmax), I_(Dmin), I_(ON)/I_(OFF). gm. and g_d. It is observed that the Ti/Au metal stack arrangement shows better results among all the metal stack arrangements and hence found to be suitable for high power RF applications with low losses.
机译:氧化镓(GA_2O_3)由于其超宽的带隙(UWB)成为未来发电电子应用的最有希望的半导体材料。 GA_2O_3半导体具有优异的材料特性,例如4.8eV的超宽带隙,承受5至9 mV / cm的击穿场以及具有优异的热和化学稳定性。此外,它具有优秀的Baliga的宗旨(B-FOM)。然而,由于与良好的欧姆接触材料相关的问题,β-GA_2O_3器件的性能仍然有限。在这项工作中,我们研究了使用多金属栅极堆叠布置对β-GA_2O_3 MOS结构性能的影响。分析中使用的性能参数是I_(DMAX),I_(DMIN),I_(ON)/ I_(OFF)。通用汽车。和g_d。观察到Ti / Au金属堆叠布置在所有金属堆叠布置中显示出更好的结果,因此发现适用于具有低损耗的高功率RF应用。

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