首页> 外文会议>Integrated Reliability Workshop Final Report, 2003 IEEE International >Charge trapping in MOCVD hafnium-based gate field dielectric stack structures and its impact on device performance
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Charge trapping in MOCVD hafnium-based gate field dielectric stack structures and its impact on device performance

机译:MOCVD ha基栅场电介质堆叠结构中的电荷俘获及其对器件性能的影响

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摘要

Threshold voltage instability and mobility degradation are significant issues for high-k dielectrics. The impact of interfacial and bulk high-k properties on these issues was investigated using Hf-based gate dielectric stacks of varying physical thickness with polysilicon electrodes. The impact of charge trapping on device performance was characterized by electrical and physical analysis. Results suggest that the bulk trapping in the high-k film contributes to the degradation of device performance.
机译:阈值电压的不稳定性和迁移率降低是高k电介质的重要问题。使用具有不同物理厚度的Hf基栅介电叠层和多晶硅电极,研究了界面和块体高k特性对这些问题的影响。电荷捕获对器件性能的影响通过电学和物理分析来表征。结果表明,高k膜中的大量陷阱会导致器件性能下降。

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