首页> 外文会议>Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP >Eliminating via-plane coupling using ground vias for high-speed signal transitions
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Eliminating via-plane coupling using ground vias for high-speed signal transitions

机译:消除了使用接地过孔进行高速信号转换的过孔平面耦合

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When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.
机译:当高速信号通过穿透平面对的通孔时,平行平面谐振会导致信号的额外插入损耗。为了消除这种通孔平面耦合,在信号通孔附近添加了接地通孔。本文讨论了接地通孔的影响与接地通孔数量,其位置以及平面对尺寸的关系。在研究中使用了基于块的基于物理的等效电路建模方法。本文还讨论了现象的潜在物理原理和设计含义。

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