Placement of ground vias for high-speed differential signals

摘要

A circuit board assembly of an information handling system has an adjacent pair of vias that carry differential communication signal through printed circuit board (PCB) substrates. Pairs of ground vias each having a first ground via and a second ground via placed symmetrically on both sides of a virtual ground plane that passes between the adjacent pair of vias. Ground vias are placed at a substantially identical radius from a respective one of the adjacent pair of vias that is on the same side of the virtual ground plane. First ground via(s) are annularly spaced substantially equally from each other and from a pair of reference points on the virtual ground plane that are each radially spaced from both of the adjacent pair of vias by the substantially identical radius. The second ground via(s) are annularly spaced from each other and the pair of reference points.