Comprehensive physics-based via models are extended to consider traces connecting vias in PCB and package structures (stripline connection). The traces routed between two power planes are described by modal decomposition to account for the contribution of the parallel plate mode and the stripline mode. The analytical formulation for two vias connected by a trace is provided in this work. It results in a fully parameterized 4-port network, formed by the parallel connection of four 4-by-4 admittance matrices corresponding to: the parallel plate mode, the stripline mode, a coupling factor resulting from the superposition of the two modes, and the capacitances between the via barrel and the power planes. With this novel formulation, good correlation with respect to full-wave simulations could be observed up to 20 GHz, with a remarkable improvement on the computation speed (up to three orders of magnitude).
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