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Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

机译：Cu-Zn / Sn-Ag-Cu / Cu-Zn焊点的跌落冲击可靠性

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《Electronic Materials and Packaging,EMAP, 2008 International Conference on》||P.236-238|共3页
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Kim Young Min; Kim Young-Ho;
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1. Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing [J] . Chi-Yang Yu, Wei-Yu Chen, Jenq-Gong Duh Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2014,第Null期

机译：在高速剪切试验下提高Sn-Ag-Cu / Cu-Zn无铅焊点的冲击韧性
2. Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing [J] . Chi-Yang Yu, Wei-Yu Chen, Jenq-Gong Duh Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2014,第Null期

机译：在高速剪切试验下提高Sn-Ag-Cu / Cu-Zn无铅焊点的冲击韧性
3. Suppressing the growth of Cu-Sn intermetallic compounds in Ni/Sn-Ag-Cu/Cu-Zn solder joints during thermal aging [J] . Chi-Yang Yu, Wei-Yu Chen, Jenq-Gong Duh Intermetallics . 2012,第Null期

机译：在热时效过程中抑制Ni / Sn-Ag-Cu / Cu-Zn焊点中Cu-Sn金属间化合物的生长
4. Intermetallic compound formation and solder joint reliability of Sn-Ag-Cu solder ball on Cu-Zn substrate [C] . Hee-Ra Roh, Young-Ho Kim 2007 international conference on electronic materials and packaging . 2007

机译：Cu-Zn基体上Sn-Ag-Cu焊球的金属间化合物形成和焊点可靠性
5. Reliability Assessment of Solder Joint Using BGA Package: Megtron 6 Versus FR4 Printed Circuit Boards Using Drop Testing [D] . Mundhe, Pradnya 2017

机译：使用BGA封装的焊点可靠性评估：Megtron 6与FR4印刷电路板的跌落测试
6. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints [O] . Jenn-Ming Song, Bo-Chang Huang, David Tarng, 2020

机译：界面金属间化合物层纳米力学响应与焊点冲击可靠性的关系
7. Effect of Interfacial Reaction Layer Thickness on Fracture Morphology and Impact Resistance of Sn-Ag-Cu Solder Bump Joint [O] . Tomoya DAITO, Hiroshi NISHIKAWA, Tadashi TAKEMOTO 2012

机译：界面反应层厚度对Sn-Ag-Cu焊接凸块接头裂缝形态和抗冲击性的影响

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