首页> 外文会议>Integrated Reliability Workshop Final Report, 2002. IEEE International >Evidence for defect-generation-driven wear-out of breakdown conduction path in ultra thin oxides
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Evidence for defect-generation-driven wear-out of breakdown conduction path in ultra thin oxides

机译:缺陷生成驱动超薄氧化物中击穿传导路径磨损的证据

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This paper considers the physical mechanisms responsible for the progressive (i.e. smooth or noisy) breakdown manifestation commonly measured on ultra-thin oxides (Tox<25 Å). First, it is verified that the theory previously published is relevant by highlighting progressive behavior predicted on thicker oxides (50 Å). Second, the stored energy is shown not to be correlated to the progressive behavior even if it influences the failure and its occurrence. At last, the progressiveness being gate voltage and temperature driven, it is stated that the defect generation probability drives the breakdown degradation after its creation. This is proven by measuring the influence on the progressiveness of a bulk bias applied during the stress of a pMOS in the inversion regime.
机译:本文考虑了通常在超薄氧化物(Tox <25Å)上测量到的逐步(即平滑或嘈杂)击穿表现的物理机制。首先,通过强调在较厚的氧化物(50)上预测的渐进行为,证实了先前发表的理论是相关的。其次,显示出所存储的能量与渐进行为无关,即使它影响故障及其发生也是如此。最后,渐进性是由栅极电压和温度驱动的,据指出缺陷产生的可能性驱动了其产生后的击穿退化。通过测量在反向状态下在pMOS应力期间施加的整体偏置的渐进性的影响,可以证明这一点。

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