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Conduction path arrangement for semiconductor technology, has support paths formed between substrate and conduction paths for supporting conduction paths
Conduction path arrangement for semiconductor technology, has support paths formed between substrate and conduction paths for supporting conduction paths
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机译:用于半导体技术的导电路径装置具有在基板和导电路径之间形成的支撑路径,用于支撑导电路径
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摘要
A conduction path arrangement has a substrate (1,2), at least two conduction paths (4), formed adjacent to one another over the substrate, and a cavity which is formed at least between the conduction paths (4), and a dielectric covering layer (5) covering the conduction paths and enclosing the cavity. The support paths (TB) between the substrate (1,2) and the conduction paths (4) are designed to support the conduction paths, in which on the contact surface, a width (B1) of the conduction paths is greater than a width (B2) of the support paths (TB). An independent claim is included for a method for fabrication a conduction path arrangement.
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