In the last about ten years a new trend made itself to foreground. This trend is to use polymers and sensitizers from which electrodepositable (ED) photoresist can be made. While the laminated dry film photoresists are highly thicker than 1 mil, an electrodeposited polymer coating is thinner than 1 mil. This parameter allows us to make extremely narrow tracks without short circuits or break of continuity. Moreover the ED resists can coat three dimensional substrates. These two advantages are the main reason to use ED resists in the future, as an alternative way beside dry film resists. The poster is made to be as a review on the present day works in the area of ED resists. The usable photosensitizers and polymers will be shown as they behave in the photoreactions. Also the ED resist creating method, the advantages and disadvantages will be presented.
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