首页> 外文会议>Indium Phosphide and Related Materials, 1992., Fourth International Conference on >High-speed, low-threshold InGaAsP semi-insulating buried crescentlasers
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High-speed, low-threshold InGaAsP semi-insulating buried crescentlasers

机译:高速,低阈值InGaAsP半绝缘埋入月牙形雷射

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The authors describe the refinement of this laser structure forhigh-speed operation and record bandwidths for a planar structure. Toachieve bandwidths in excess of 20 GHz, it is necessary to increase theslope of the resonance frequency vs. output power so that higherbandwidths are achieved at lower bias currents. This is accomplished byreducing the active channel width to 1 μm, by p-doping the activelayer, and by cleaving cavity lengths as short as 100 μm. Inaddition, the parasitic capacitance is further reduced by limiting thep-contact width to 12 μm, and by the use of a thick polyimide layerunder the bond pad metal. Lasers fabricated in this manner exhibitedthresholds as low as 6 mA, with maximum output powers of 15 mW per facetat 100 mA bias current. The total differential quantum efficiency wastypically 45-55%
机译:作者描述了这种激光结构的改进。 高速操作并记录平面结构的带宽。到 要实现超过20 GHz的带宽,有必要增加 谐振频率与输出功率的斜率,因此更高 在较低的偏置电流下可获得带宽。这是通过完成 通过对有源器件进行p掺杂,将有源沟道宽度减小到1μm 层,并通过切开短至100μm的腔体长度。在 此外,通过限制寄生电容可以进一步减小寄生电容。 p接触宽度为12μm,并使用厚的聚酰亚胺层 在焊盘金属下。以这种方式制造的激光器表现出 阈值低至6 mA,每面最大输出功率为15 mW 在100 mA偏置电流下。总微分量子效率为 通常为45-55%

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