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High-yield design of high-density SRAM for low-voltage and low-leakage operations

机译:高密度SRAM的高产量设计,适用于低压和低泄漏操作

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The minimum functional voltage of System-On-Chip manufactured in recent technology nodes is often that of its Static Random-Access Memories (SRAM). Operating SRAM at subnominal voltage requires the use of additional circuits named assist circuits. This paper details the write assist and the temperature- and process-compensated read assist circuits used against insufficient bitcell Write Margin (WM) and Static Noise Margin (SNM), respectively. A new graphic tool named yieldogram is introduced to monitor clearly over a supported temperature range the capacity-dependent safe design region at various yield targets, including the highest industrial standard (1ppm), and is used to evaluate graphically the effects of different combinations of assist. We show that our implementation of WordLine UnderDrive (WLUD) assist technique against SNM limitations has a minimum impact on the performance, since it is temperature- and process-compensated, while negative BitLine implementation against WM limitations improves performances. The combined use of both techniques allows to gain more than 20% Vddmin, improving the frequency by 15%, decreasing dynamic power by 10% with worst-case increases in area and static power of 10 %. Finally, with a small WLUD overhead, yield can be obtained on Mass-Scale Production even after ageing.
机译:在最新技术节点中制造的片上系统的最低功能电压通常是其静态随机存取存储器(SRAM)的最低功能电压。在低于标称电压的条件下操作SRAM需要使用名为辅助电路的附加电路。本文详细介绍了分别针对位单元写裕度(WM)和静态噪声裕度(SNM)不足而使用的写辅助以及温度和过程补偿的读辅助电路。引入了一种名为yieldogram的新图形工具,以在支持的温度范围内清晰监视各种产量目标(包括最高工业标准(1ppm))下与容量有关的安全设计区域,并用于以图形方式评估助剂不同组合的效果。我们展示了针对SNM限制的WordLine UnderDrive(WLUD)辅助技术的实现对性能的影响最小,因为它是温度和过程补偿的,而针对WM限制的负BitLine实现则可以提高性能。两种技术的组合使用可以使Vddmin超过20%,将频率提高15%,将动态功率降低10%,而最坏情况下的面积增加,静态功率提高10%。最终,以较小的WLUD开销,即使在老化后也可以在大规模生产中获得产量。

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