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High-Yield Design of High-Density SRAM for Low-Voltage and Low-Leakage Operations

机译:低压和低泄漏操作的高密度SRAM的高屈服设计

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The minimum functional voltage of System-On-Chip manufactured in recent technology nodes is often that of its Static Random-Access Memories (SRAM). Operating SRAM at subnominal voltage requires the use of additional circuits named assist circuits. This paper details the write assist and the temperature- and process-compensated read assist circuits used against insufficient bitcell Write Margin (WM) and Static Noise Margin (SNM), respectively. A new graphic tool named yieldogram is introduced to monitor clearly over a supported temperature range the capacity-dependent safe design region at various yield targets, including the highest industrial standard (1ppm), and is used to evaluate graphically the effects of different combinations of assist. We show that our implementation of WordLine UnderDrive (WLUD) assist technique against SNM limitations has a minimum impact on the performance, since it is temperature- and process-compensated, while negative BitLine implementation against WM limitations improves performances. The combined use of both techniques allows to gain more than 20% Vddmin, improving the frequency by 15%, decreasing dynamic power by 10% with worst-case increases in area and static power of 10%. Finally, with a small WLUD overhead, yield can be obtained on Mass-Scale Production even after ageing.
机译:最近技术节点中的片上系统的最小功能电压通常是其静态随机接入存储器(SRAM)的常规。在亚单晶电压下的SRAM需要使用辅助电路的附加电路。本文详细介绍了用于抵抗不足的位单元写裕度(WM)和静态噪声裕度(SNM)的写辅助和温度和处理补偿的读取辅助电路。引入了一个名为Leationogram的新图形工具,以清楚地监测在支持的温度范围内,在各种产量目标的容量相关的安全设计区域,包括最高的工业标准(1ppm),并且用于以图形方式评估不同组合的辅助组合的影响。我们表明,我们对SNM限制的Wordline Internive(Wlud)辅助技术的实现对性能具有最低影响,因为它是温度和处理补偿,而对WM限制的负位线路实现提高了性能。两种技术的结合使用允许获得20%以上的VDDMIN,将频率提高15%,通过最坏情况下降10%的动力功率降低10%,静电增加10%。最后,通过小的Wlud开销,即使在老化后也可以在大规模生产中获得产量。

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