Validating 2.5D System-in-Package inter-die communication on silicon interposer

摘要

2.5D Integrated Circuit (IC) technology is a new approach in designing System-in-Package (SiP) which offer flexibility in mixing dice available in different technology nodes and applications inside a single package and interconnecting them on silicon interposer. This results in reducing overall system complexity, less on-board components, cost and size. This technology is capable of powering next generation ICs targeted towards tablets, cell phones and portable electronics. 2.5D technology differs from existing 2D-IC technologies such as System-on-Chip (SoC), Multi-Chip Module (MCM) and System-in-Package (SiP) in terms of usage of silicon interposer as a medium for inter-die communication. This provides high bandwidth, low power dissipation and overcomes routing congestion. Sample use cases of 2.5D are explained in the paper. A test chip project showcases functional working of 2.5D IC on Printed Circuit Board (PCB). Finally, usage of 2.5D-IC technology for multi-domain, multi-manufacturing node is been proposed and concluded.