首页> 外文会议>Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International >350V/150A AlGaN/GaN power HFET on silicon substrate with source-via grounding (SVG) structure
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350V/150A AlGaN/GaN power HFET on silicon substrate with source-via grounding (SVG) structure

机译:具有源极接地(SVG)结构的硅衬底上的350V / 150A AlGaN / GaN功率HFET

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We present a high power AlGaN/GaN HFET fabricated on a conductive Si substrate with a source-via grounding (SVG) structure. The device has a very low specific on-state resistance of 1.9 mΩ·cm2 and a high off-state breakdown voltage of 350 V, and a current handling capability of 150 A. In addition, a sub-nano second switching tr of 98 psec and tf of 96 psec, with a current density as high as 2.0 kA/cm2 is demonstrated for the first time.
机译:我们提出了一种高功率的AlGaN / GaN HFET,该材料在具有源孔接地(SVG)结构的导电Si衬底上制造。该器件的导通电阻很低,仅为1.9mΩ·cm 2 ,关断击穿电压很高,为350 V,电流处理能力为150A。电流密度高达2.0 kA / cm 2 的-nano第二开关t r 为98皮秒,t f 为96皮秒第一次展示。

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