Evaluation and optimization of package processing, design, andreliability through solder joint profile prediction

摘要

Solder joints are generated using a variety of methods to provideboth mechanical and electrical connection for applications such asflip-chip, wafer level packaging, fine pitch, ball-grid array, and chipscale packages. Solder joint shape prediction has been incorporated as akey tool to aid in process development, wafer level and package leveldesign and development, assembly, and reliability enhancement. This workdemonstrates the application of an analytical model and the SurfaceEvolver software in analyzing a variety of solder processing methods andpackage types. Bump and joint shape prediction was conducted for thedesign of wafer level bumping, flip-chip assembly, and wafer levelpackaging. The results from the prediction methodologies are validatedwith experimentally measured geometries at each level of design