Solder ball connection reliability model and critical parameteroptimization

摘要

Surface mount array packages have been qualified by IBM for up to625 I/O. Array packages are difficult to inspect and cannot be repairedat card assembly. Therefore, in order to ensure reliable joints, thecritical process parameters have been determined. A model was obtainedin which the reliability of the product can be predicted from actualbuild values of the critical parameters. Control of the criticalparameters can ensure product quality