Copper polyimide multilayer substrate for high speed signaltransmission

摘要

Copper-polyimide substrate has been developed for high-speedsignal transmission use. This substrate is combined with thick-filmcofired technology and thin-film multilayer technology, and it iseffective for higher-density packaging use. By using copper-polyimidemultilayer substrate with tight tolerance cofired alumina ceramics inconjunction with highly conductive internal metallization, electricalperformance in the high-frequency region has been improved. The resultsof environmental reliability tests and high-frequency evaluationsindicate that these products are ready for application