Polyimide, polyimide adhesive, film like adhesive, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate and printed circuit board, multilayer wiring board and its manufacturing method

摘要

PROBLEM TO BE SOLVED: To provide a new polyimide exhibiting high storage modulus of rigidity even on a B-stage temperature condition; a new polyimide-based adhesive which is a composition using the polyimide and provides an adhesive layer having good adhesion, heat-resistant adhesiveness, flow controllability and low dielectric characteristics; and a film-like adhesive material obtained by the adhesive.SOLUTION: There are provided polyimide (1) which is a reactant of a monomer group containing an aromatic tetracarboxylic acid anhydride (A) and diamine (B) containing dimer diamine (b1) and trimer triamine (b2) so that a mass ratio [(b1)/(b2)] is in a range of 97/3 to 70/30; a polyimide-based adhesive containing the (1) component, a crosslinking agent (2) and an organic solvent (3); and a film-like adhesive material obtained from the polyimide-based adhesive.SELECTED DRAWING: Figure 1