The authors discuss the failure analysis performed on severalhybrid devices submitted to Oneida Research Services, Inc. The analysiswas initiated because of electrical testing failures-a voltage dividerexhibited an out-of-specification value during burn-in at elevatedtemperature. This voltage divider compared the outputs of two thick-filmresistors. Analysis of the hybrid failures revealed a copper dendriticgrowth propagating across the laser trims in the thick film resistor.The authors describe the hybrid materials construction, environmentaltesting, and electrical testing performed in examining the factors whichled to the dendrite growth and overall failure of the hybrids. Adetailed description of the analytical equipment and methodology used inidentifying the cause of the copper dendrite growth as a result ofprocessing is presented. The authors conclude with a discussion of thefailure analysis
展开▼
