首页> 外国专利> MATERIAL FOR THICK FILM RESISTOR, PASTE FOR THICK FILM RESISTOR, THICK FILM RESISTOR, THICK FILM RESISTOR APPARATUS, MANUFACTURING METHOD OF THICK FILM RESISTOR AND MANUFACTURING METHOD OF THICK FILM RESISTOR APPARATUS

MATERIAL FOR THICK FILM RESISTOR, PASTE FOR THICK FILM RESISTOR, THICK FILM RESISTOR, THICK FILM RESISTOR APPARATUS, MANUFACTURING METHOD OF THICK FILM RESISTOR AND MANUFACTURING METHOD OF THICK FILM RESISTOR APPARATUS

机译:厚膜电阻器的材料,厚膜电阻器的浆糊,厚膜电阻器,厚膜电阻器装置,厚膜电阻器的制造方法和厚膜电阻器的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a thick film resistor with no gap formed at a portion where an electrode and a thick film resistor overlap, capable of securing a stable conduction, with a smaller change in a value of resistance after electrostatic discharge.;SOLUTION: A material for a thick film resistor includes palladium powder whose surface is covered at least partially with silver and/or palladium alloy powder whose surface is covered at least partially with silver. A mass ratio of the silver and the palladium is 4:6-7:3. The palladium powder and the palladium alloy powder have a number-average particle diameter D50 of 0.1-5 μm.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT
机译:解决的问题:提供一种厚膜电阻器,该厚膜电阻器在电极和厚膜电阻器重叠的部分不形成间隙,能够确保稳定的导电性,并且静电放电后的电阻值变化较小。 :用于厚膜电阻器的材料包括其表面至少部分地被银覆盖的钯粉和/或其表面至少部分地被银覆盖的钯合金粉。银和钯的质量比为4:6-7:3。钯粉和钯合金粉的数均粒径D50为0.1-5μm.;部分制图:图1;版权:(C)2018,JPO&INPIT

著录项

  • 公开/公告号JP2018133166A

    专利类型

  • 公开/公告日2018-08-23

    原文格式PDF

  • 申请/专利权人 SUMITOMO METAL MINING CO LTD;

    申请/专利号JP20170024986

  • 发明设计人 KAWAKUBO KATSUHIRO;

    申请日2017-02-14

  • 分类号H01B1/22;H01C17/065;H01B1;H01B1/16;

  • 国家 JP

  • 入库时间 2022-08-21 13:13:13

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