System level packaging of high density optoelectronicinterconnections

摘要

Large telecommunication switching and transmission platforms havemassive interconnection requirements which have been doubling every12-18 months. A discontinuity in interconnection requirements and totalsystem bandwidth caused by DWDM technology and all optical switchingtechnology is about to cause an enormous increase in interconnectionrequirements. This will result in a substantial increase in the numberof fibers in a system, a substantial increase in the number of opticalfibers per circuit board or unit in a system, and a substantial increasein the bandwidth carried per optical fiber in a system. Totally newpackaging concepts will be required to cope with rapid changes. Pastchanges in optoelectronic packaging have tended to be evolutionaryrather than revolutionary. The early years of the 2000 decade willrequire revolutionary changes in optoelectronic packaging in order justto keep pace with the pacing technologies and for the demand forbandwidth