Effect of package design and layout on BGA solder joint reliabilityof an organic C4 package

摘要

Ball Grid Array (BGA) is currently the interconnect of choice forattaching microprocessors on a printed circuit board (PCB). Thereliability of solder joints is one of the critical issues in BGAsurface mount technology (SMT). During reliability testing, BGA fatiguefailures were observed on test vehicles (TV). Finite element analysisand physical failure analysis were used to determine the risk to theproduct in the field. As part of this effort, parametric finite elementanalysis was carried out to determine the effect of design features likethe package size, and BGA pattern on the propensity of fatigue failure.The results of the finite element analysis and physical failure analysisshowed that the risk to fatigue failure was much greater on aperipheral/partial grid array package than in a full grid array package