Contribution ratio of process fidelity and beam accuracy in multi-beam mask writing

摘要

We investigated the contribution ratio of process fidelity and beam accuracy in patterning with the multi-beam mask writing system. A beam pitch-related line edge profile may occur, which impacts on line edge roughness (LER) in the multi-beam writing system. The printability of beam image into the final etched pattern depends on the mask process, therefore, we need to understand quantitatively the printability of beam placement errors on LER with the actual mask process. We examined how the patterning characteristics are modified in each step of the mask process. The printability of beam placement errors largely depend on the period of errors, rather than the amplitude of errors. These results can optimize the writing strategy in multi-beam mask writing.