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Degradation Mechanism of Short Channel p- FinFETs under Hot Carrier Stress and Constant Voltage Stress

机译:热载流应力和恒压应力作用下短沟道p- FinFET的降解机理

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In this paper, degradation behaviors of short channel high-klmetal gate p-FinFETs under hot carrier stress (HCS) and constant voltage stress (CVS) were compared to clarify the coupling ratio of NBTI component in hot carrier degradation (HCD). A discharge-based multi-pulse (DMP) technique was carried out to accurately analyze the energy distribution of interface trap and bulk trap under different stress conditions. Experiments show that the threshold voltage shift under CVS is about 3 times larger than that under HCS with the same stress bias. For both HCD and NBTI, the bulk hole trapping is dominant.
机译:本文比较了短沟道高k金属栅极p-FinFET在热载流子应力(HCS)和恒定电压应力(CVS)下的退化行为,以阐明NBTI分量在热载流子退化(HCD)中的耦合比。进行了基于放电的多脉冲(DMP)技术,以准确分析在不同应力条件下的界面陷阱和本体陷阱的能量分布。实验表明,在相同的应力偏置下,CVS下的阈值电压偏移约为HCS下的阈值电压偏移的3倍。对于HCD和NBTI而言,主要是空穴陷阱。

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