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Threshold voltage bitmap analysis methodology: Application to a 512kB 40nm Flash memory test chip

机译:阈值电压位图分析方法:在512kB 40nm闪存测试芯片中的应用

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The reliability requirements of Flash memory become more and more challenging. Flash memory technology development needs test chips to allow large statistical studies and a product-like approach. In this paper, we present a methodology of bitmap analysis to extract and follow the intrinsic and extrinsic parameters of a 40nm eFlash technology during ramp-up. This methodology is, first, based on analog bitmap acquisition on 512kB test chip, followed by correction of spatial variabilities like peripheral circuits' influences, array organization impacts and process-induced effects, to extract supplementary cell electrical parameters such as threshold voltage, transconductance or programing window. Finally, such an analysis tool enhances the advantageous properties of a test chip, its large memory cell statistics and its product-like organization, to give more reliable data. It yields more information about intrinsic cell technology weaknesses and the best way to tackle them when integrated at product level.
机译:闪存的可靠性要求变得越来越具有挑战性。闪存技术的发展需要测试芯片,以进行大量的统计研究和采用类似产品的方法。在本文中,我们提出了一种位图分析的方法,以在加速过程中提取并遵循40nm eFlash技术的内在和外在参数。该方法首先基于在512kB测试芯片上的模拟位图采集,然后校正空间变异性(例如外围电路的影响,阵列组织的影响和过程引起的影响),以提取补充的电池电参数,例如阈值电压,跨导或编程窗口。最后,这种分析工具增强了测试芯片的优势特性,大型存储单元统计信息以及类似产品的组织,从而提供了更可靠的数据。它提供了有关固有电池技术弱点的更多信息,以及在产品级别进行集成时解决这些弱点的最佳方法。

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