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Double Side Sintered IGBT + FRD, 650 V / 200 A, in a STO247 Package for High Performance Automotive Applications

机译:采用STO247封装的双面烧结IGBT + FRD,650 V / 200 A,适用于高性能汽车应用

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Double side sintered STO247 type packaged devices from Renesas Electronics America (REA) (tentative part number: xJH6501DPz, currently under development) are benchmarked against the leading device on the market used in high performance electric cars. The Renesas component utilize 650 V, 200 A rated IGBT die copackaged with a similarly rated companion FRD die. Both components are interchangeable on the same board footprint, since the dimensions are approximately the same. Samples of both devices were tested at a delta Tj of 85 deg C and the xJH6501DPZ proved to be at least 12 times more reliable than the leading device on the market (which failed at around 12 k cycles and the Renesas parts are still electrically functioning and within target specification after 150k cycles). The fully sintered Renesas STO247 packaged samples were also subjected to a delta Tj of 110 deg C and demonstrated no signs of failure, even after 350 k cycles.
机译:瑞萨电子美国公司(REA)的双面烧结STO247型封装器件(暂定零件编号:xJH6501DPz,目前正在开发中)以高性能电动汽车上使用的市场领先器件为基准。瑞萨组件采用了650 V,200 A额定IGBT裸片,并与类似额定的配套FRD裸片一起封装。由于尺寸大致相同,因此两个组件都可以在相同的电路板上占位,可以互换。两种器件的样品都在85摄氏度的Tj下进行了测试,并且xJH6501DPZ的可靠性至少比市场上领先的器件高出12倍(该器件在大约12 k周期后失效,瑞萨的零件仍在电运作,并且在150k次循环后达到目标规格)。完全烧结的瑞萨电子STO247包装的样品也经受了110摄氏度的Tj值,即使经过350 k次循环也没有失效迹象。

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