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Double Side Sintered IGBT + FRD, 650V/200A, in a STO247 Package for High Performance Automotive Applications

机译:双面烧结IGBT + FRD,650V / 200A,在STO247封装中进行高性能汽车应用

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Double side sintered STO247 type packaged devices from Renesas Electronics America (REA) (tentative part number: xJH6501DPz, currently under development) are benchmarked against the leading device on the market used in high performance electric cars. The Renesas component utilize 650V, 200A rated IGBT die co-packaged with a similarly rated companion FRD die. Both components are interchangeable on the same board footprint, since the dimensions are approximately the same. Samples of both devices were tested at a delta Tj of 85°C and the xJH6501DPZ proved to be at least 12 times more reliable than the leading device on the market (which failed at around 12k cycles and the Renesas parts are still electrically functioning and within target specification after 150k cycles). The fully sintered Renesas STO247 packaged samples were also subjected to a delta Tj of 110°C and demonstrated no signs of failure, even after 350k cycles.
机译:双面烧结STO247型号来自Renesas Electronics America(Rea)的封装设备(暂定部件号:目前正在开发的XJH6501DPZ)采用高性能电动汽车中使用的市场领先的市场基准测试。瑞萨组件利用650V,200A额定IGBT模具共同包装,具有类似额定伴侣FRD模具。由于尺寸大致相同,因此两个部件都是相互互换的。在85°C的Delta Tj测试两种装置的样品,并且XJH6501DPZ被证明比市场上的领先装置(在12K周期约为12K循环,瑞萨零件仍处于电力运行和内部150K循环后的目标规格)。完全烧结的肾素STO247包装样品也经过110℃的ΔTJ,并在350K循环之后证明了甚至均未发生故障迹象。

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