Application dependency of 3-D integrated hybrid solid-state drive system with through-silicon via technology

摘要

Study of storage class memory (SCM) /NAND flash memory hybrid solid-state drive (SSD) is developed for enterprise storage system. The hybrid SSDs for enterprise applications require a large capacity. However, the larger hybrid SSD capacity becomes, the more energy is consumed. Then, through silicon-via (TSV) technology realizes to reduce energy consumption and footprint of the hybrid SSDs. In this paper, the energy consumption of three-dimensional (3-D) hybrid SSDs with the TSV are evaluated, and design guideline for the hybrid SSD system with the TSV is presented for application characteristics. From the evaluation results, the TSV is effective for the small-capacity low-end mobile hybrid SSD with the read-hot application, and 25.7% energy consumption reduction is obtained with the TSV. Additionally, the TSV is effective for the large-capacity high-end enterprise hybrid SSD with the read-cold application, and the energy consumption reduces by 56.6% with applying the TSV.