New Designs for MEMS-Micromirrors and Micromirror Packaging with Electrostatic and Piezoelectric Drive

摘要

Developments for miniaturized, MEMS based micro-mirrors are an active area of ongoing research due to the promising perspectives for cost efficient and precise pico-projectors and scanners for e.g. LIDAR applications. In this article we report several devices of 1 -dim and 2-dim micro-mirrors based on new designs and new process capabilities using piezoelectric actuators. For micro-mirrors an 8" wafer-level packaging process was developed using pre-processed borosilicate glass wafers. An optimized design of an optical package is presented that avoids any stray reflexes and ghost images in laser projection applications. For 1dim piezoelectric micro-mirrors, diameter 1.2 mm and 1 mm, scan angles in resonance mode of 40° and 73.2° at frequencies of 60 kHz and 27 kHz in ambient air have been achieved in various designs with driving voltages between 10 V and 15 V. Devices for 2-dim microscanners with electro-static and piezo-electric actuation are presented.