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Modelling the temperature dependence of 28nm fully depleted silicon-on insulator (FDSOI) static characteristics based on parallel computing approach

机译:基于并行计算方法的28nm全耗尽型硅绝缘子(FDSOI)静态特性对温度依赖性的建模

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This paper provides a behavioral model of 28nm FDSOI technology for a wide temperature range. In this work, a multivariate interpolation lookup tables (LUTs) model considering temperature dependence for nanometer CMOS transistors is presented. The new approach is validated by comparison with the bias current and capacitances tables in a given wide range of the temperature for the simulation of MOS transistor circuits. This novel approach significantly enhances the simulation speed with sufficient accuracy via a dynamic programming procedure over the current state of the art models. Simulation results are implemented in a 28-nm fully depleted SOI (FDSOI) technology. The proposed model achieving speedups of up to eight orders of magnitude at transistor level considering temperature effect found in FDSOI compared to simulations with both the BSIM SOI model and the Lagrange interpolation lookup table model.
机译:本文提供了一个28nm FDSOI技术在较宽温度范围内的行为模型。在这项工作中,提出了考虑温度依赖性的纳米CMOS晶体管的多元插值查找表(LUT)模型。通过与给定的宽温度范围内的偏置电流和电容表进行比较,对新方法进行了验证,以模拟MOS晶体管电路。这种新颖的方法通过动态编程程序,在当前最新模型的状态下,以足够的精度显着提高了仿真速度。仿真结果是在28纳米全耗尽SOI(FDSOI)技术中实现的。与使用BSIM SOI模型和Lagrange插值查找表模型进行的仿真相比,考虑到FDSOI中发现的温度效应,所提出的模型在晶体管级实现了高达八个数量级的加速。

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