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Exploring the origin of charging-induced pattern positioning errors in mask making using e-beam lithography

机译:探索使用电子束光刻在掩模制造中由电荷引起的图案定位错误的根源

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The authors present a detailed observation of the charge-induced pattern positioning errors (CIPPEs) in a variable-shape e-beam writer on an opaque-MoSi-over-glass (OMOG) mask by directly measuring the pattern shifts using a mask registration tool. The CIPPEs are found to have one short-range, that is exponentially decaying in space, and the other constant offset components. The exponential term that decays slowly in time, whereas the constant offset fast diminishes. By applying a charge dissipation layer (CDL), the authors experimentally verify that the exponential component results from the charges in resist. On the other hands, the constant offset that can not be eliminated by the CDL is speculated to be charges in the substrate according to the Monte Carlo simulation.
机译:作者通过使用掩模配准工具直接测量图案偏移,来详细观察不透明的MoSi-over-glass(OMOG)掩模上的可变形状电子束刻记器中的电荷感应图案定位误差(CIPPE)。 。发现CIPPE具有一个短程(在空间中呈指数衰减)和其他恒定偏移分量。指数项随时间缓慢衰减,而常数偏移快速减小。通过应用电荷耗散层(CDL),作者通过实验验证了指数成分是由抗蚀剂中的电荷产生的。另一方面,根据蒙特卡洛模拟,推测不能被CDL消除的恒定偏移是基板中的电荷。

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