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High switching speeds and loss reduction: prospects with Si, SiC and GaN and limitations at device, packing and application level

机译:高开关速度和降低损耗:Si,SiC和GaN的前景以及器件,封装和应用水平的局限性

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摘要

The prospect of increasing the switching frequency without sacrificing efficiency is seen in many fields of application as a promising development for the current decade. This will be mainly achieved through new device technologies, not only relying on WBG materials but also on silicon, capable of operating at much faster switching speeds and thus with lower losses. Several enhancements in the field of packing and montage are nevertheless still necessary in order to fully exploit the referred power devices' capabilities. In addition to this, other issues at application level concerning EMI, driving and also the influence of transient speed at inductor losses still need to be addressed. This paper will present an overview of these issues based on experimental results and literature research in order to assert future development trends.
机译:在许多应用领域中,在不牺牲效率的情况下增加开关频率的前景被认为是当前十年的有希望的发展。这将主要通过新的设备技术来实现,不仅依赖于WBG材料,而且还依赖于硅,硅能够以更快的开关速度运行,从而损耗更低。为了充分利用所提及的功率设备的功能,仍然需要在包装和蒙太奇领域中进行一些增强。除此之外,在应用程序级别上还涉及电磁干扰,驱动以及瞬态速度对电感器损耗的影响等其他问题。本文将根据实验结果和文献研究对这些问题进行概述,以断言未来的发展趋势。

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