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Resistive Switching Characteristics of Zinc Oxide Resistive RAM Doped with Nickel

机译:掺镍氧化锌电阻RAM的电阻开关特性

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Resistive switching characteristics of zinc oxide thin films with nickel doped were investigated in this paper. A device cell with the structure of TiN/ZnO/Ni/ZnO/Pt/substrate was fabricated by radio frequency magnetron sputtering. The cells showed stable bipolar with an on/off ratio of ~10~4 at a set voltage of 2V. Comparing with TiN/ZnO/Pt RRAM structure, Ⅰ-Ⅴ curve results of Ni-doped samples demonstrated that the electrical properties of ZnO films changed, especially Ni significantly decreased the reset current of ZnO films. The influence of annealing was also investigated, the results showed that annealing was helpful to reduce reset current and avoid a high-voltage forming process, and annealing with 400 °C is the optimal condition for this structure.
机译:研究了掺杂镍的氧化锌薄膜的电阻开关特性。通过射频磁控溅射制备了具有TiN / ZnO / Ni / ZnO / Pt /衬底结构的器件单元。在2V的设定电压下,电池表现出稳定的双极型,开/关比约为10〜4。与TiN / ZnO / Pt RRAM结构相比,掺Ni样品的Ⅰ-Ⅴ曲线结果表明,ZnO薄膜的电学性质发生了变化,特别是Ni显着降低了ZnO薄膜的复位电流。还研究了退火的影响,结果表明退火有助于减少复位电流并避免高压形成过程,而400°C的退火是该结构的最佳条件。

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