Electromagnetic Interactions between Interconnected Patch-ring (IPR) Structures and Planes in Electronic Packages and PCBs

摘要

In this contribution, an interconnected patch ring (IPR) structure for noise suppression in the cavity of power-ground plane pairs is designed, fabricated and measured. The impact of electromagnetic interactions between an integrated/embedded IPR and power/ground planes in electronic packages and printed circuit boards is extensively studied. Our results reveal that the presence of a metal layer (i.e., a power/ground plane) above an IPR causes the excitation of parallel-plate modes and undesired coupling, which leads to the disappearance of the stopband of the IPR. Design methods to prevent this disappearance are investigated.