Printed circuit boardPCB comprising one-layer wire pattern semiconductor package comprising the PCB electrical and electronic apparatus comprising the package method for fabricating the PCB and method for fabricating the package

摘要

The idea of the present invention is to provide a printed circuit board (PCB) including a single-layer wiring pattern which can simplify the structure of the PCB and improve the bonding characteristics and reliability of the micro bumps at the time of flip-chip bonding, , A semiconductor package including a PCB, an electric and electronic device including a semiconductor package, a PCB manufacturing method, and a semiconductor package manufacturing method. The PCB includes a body resin of a flat plate structure having a lower surface and an upper surface; A one-layered wire pattern formed of either the upper surface or the lower surface of the body resin and having a solder ball land to be coupled with the solder ball or a bump land to be coupled to the semiconductor chip; And a solder resist (SR) formed on the top and bottom surfaces of the body resin so as to cover the single-layer wiring pattern and having openings corresponding to the solder ball lands or the bump lands. The semiconductor package may further include: a semiconductor chip; Wherein the semiconductor chip is mounted by wire bonding or flip-chip bonding; And a sealing material for sealing the semiconductor chip.