3D-SIC with multiple towers, which integrates multiple stacked die-towers on the bottom die, enhances the performance and integration density of semiconductor chips. Test scheduling helps to reduce test time of the complex chips. Towards the whole integration process of 3D-SICs, Quantum-behaved Particle Swarm Optimization (QPSO) based test scheduling algorithm is proposed. Experimental results show that the algorithm can reduce total test time of 3D-SIC significantly, and the test time is affected by the number of test pins and test Through-Silicon Vias (TSVs). It is found out that the 3D-SIC with the complex dies as the top dies result in shorter test time.
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