首页> 外文会议>China Semiconductor Technology International Conference >Improved Method to Analysis the Doping Profile for Ion Implants in Silicon
【24h】

Improved Method to Analysis the Doping Profile for Ion Implants in Silicon

机译:改进的方法,用于分析硅中的离子植入物的掺杂曲线

获取原文

摘要

Ion implantation is a core technology for the fabrication of integrated circuits (IC) and the doping profile determines the device performance. Generally, the doping profile can be controlled by adjusting energy and dose, or multiple implantation steps, which usually costs a lot. In this paper, we present an inexpensive and efficient method for investigation the distributions profile of ion implants in silicon based on SILVACO TCAD tools. The simulated doping profiles of the Born are excellent agreement with the SIMS measurements for a wide range of energies and doses. In addition, doping profiles of the Phosphorus and Arsenic ion for variations in the energy and dose was also investigated in this paper.
机译:离子植入是用于制造集成电路(IC)的核心技术,并且掺杂轮廓确定器件性能。 通常,可以通过调节能量和剂量或多种植入步骤来控制掺杂曲线,或多种植入步骤来控制,这通常需要花费很多。 在本文中,我们介绍了基于Silvaco TCAD工具的硅中离子植入物的分布曲线的廉价且有效的方法。 出生的模拟掺杂轮廓与SIMS测量的良好协议,用于广泛的能量和剂量。 此外,还研究了本文的掺杂磷和砷离子的磷和砷离子的变化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号